New ULTEM* polyetherimide (PEI) and EXTEM* thermoplastic polyimide (TPI) resins meet the material requirements for the optoelectronics industry. These resins have building blocks enabling IR light tra...
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These resins undertake scalability and manufacturability concerns regarding traditional materials, and open new opportunities to advance the state of the art in optical component design,
Our TPI granules meet rigorous international quality standards to guarantee consistent performance across industries. From injection-molded aerospace components to precision electronics parts, TPI
These advanced materials significantly enhance thermal management in 3D packaging structures, supporting demanding applications such as high-performance computing and optical
The optical module is a very important component in an optical communication system. This article will introduce you to the internal components and structure of
On the other end of the spectrum, thermoplastic polyimide (TPI) is a high-performance polymer with good flame and heat resistance, and long-term
OptiTIM is a durable thermal interface material that can withstand the insertion and removal requirements of the pluggable module while maintaining the thermal performance.
The pure TPI resin powder was dried at 205°C for 6 h in a vacuum dryer, and then extruded at elevated temperature with carbon fiber, glass fiber, graphite, poly(tetrafluoroethylene) (PTFE) or molybdenum
This material has exceptional mechanical, thermal, and chemical resistance properties and is suitable for the most demanding applications in the aerospace, automotive, electronics, and industrial markets.
Thermoplastic polyimides (TPIs) exhibit favorable processing capabilities, and meanwhile preserve most of the superior properties of PIs, such as excellent heat resistance,
New ULTEM* polyetherimide (PEI) and EXTEM* thermoplastic polyimide (TPI) resins meet the material requirements for the optoelectronics industry. These resins have building blocks
These advanced materials significantly enhance thermal management in 3D packaging structures, supporting demanding applications
D. J. Progar, T. L. St. Clair and J. R. Pratt, "Thermoplastic Adhesives Based on 4,4''-Isophthaloyldiphthatic Anhydride (IDPA)", in Polyimides: Materials, Chemistry and Characterization,
Find products and reference designs for your system. View the TI Optical module block diagram, product recommendations, reference designs and start designing.
This material has exceptional mechanical, thermal, and chemical resistance properties and is suitable for the most demanding applications in the aerospace, automotive, electronics, and industrial markets.
19-inch racks, wall-mount cabinets, open frames with high load capacity and seismic rating.
IP55/IP66 outdoor enclosures with integrated cooling/heating, -40°C to +55°C operation.
Intelligent PDUs with remote monitoring, per-outlet switching, and environmental sensors.
Prefabricated telecom shelters, emergency comms shelters, and network cabinets with cable management.
We provide custom infrastructure solutions, from telecom racks to smart PDUs and outdoor shelters.
From design to deployment, our team ensures reliable, efficient, and scalable power & enclosure systems.
ul. Głogowska 128, 60-248 Poznań, Greater Poland Voivodeship, Poland
+48 537 928 416 | +48 537 928 416 | [email protected]