BREAKTHROUGH IN THIN FILM BASED INTEGRATED
Senior scientist Dr. Claudiu Valentin Falub explains how the LLS EVO II allows engineering of superior soft magnetic multilayers that ultimately led to ultra-low profile integrated magnetic solenoid micro
Methods for manufacturing integrated magnetic components and LED power
The present disclosure provides an integrated magnetic component, a method for manufacturing the integrated magnetic component, and an integrated LED power supply including the magnetic
Pol integrated power supply module and production process
The application discloses a POL integrated power supply module and a production process thereof. The POL integrated power supply module comprises an inductor assembly, a substrate,...
Modeling and Design of Planar Integrated Magnetic Components
In the integrated electromagnetic approach, the electromagnetic components such as transformers, inductors and capacitors are built up using successive planar layers of conducting, magnetic, and
Design procedure for pot-core integrated magnetic component
LLC resonant converters and dual active bridge converters. This paper presents an easy to follow design procedure for this component, translating the co.
MAGNETIC INTEGRATED DEVICE AND POWER
As shown in FIG. 2, key units of the three-phase parallel LLC power supply conversion circuit include six magnetic elements, namely three res-onant inductors LR1, LR2, and LR3 and three transform-ers
Presentation
Demonstrated high-Bsat magnetic nanogranular materials and explored the effect of various dielectric layers on the performances of laminated magnetic structures
Whitepaper
With an emphasis in designing high-density switched mode power supplies to get the most power and eficiency in the least amount of space, managing thermal issues, and reducing costs, an excellent
Organic package substrate embedded coupled magnetic core
This paper presents the design, fabrication, and demonstration of package-embedded coupled magnetic core inductors on an organic packaging substrate for power supply in package
Low cost embedded heterogeneous component manufacturing
Low cost embedded heterogeneous component manufacturing process for integrated power electronics - ECOMAP OVERVIEW This project aimed to develop a low cost, scalable manufacturing process
Telecom Racks & Cabinets
19-inch racks, wall-mount cabinets, open frames with high load capacity and seismic rating.
Outdoor Climate Cabinets
IP55/IP66 outdoor enclosures with integrated cooling/heating, -40°C to +55°C operation.
Smart PDUs & Power Distribution
Intelligent PDUs with remote monitoring, per-outlet switching, and environmental sensors.
Shelters & Network Cabinets
Prefabricated telecom shelters, emergency comms shelters, and network cabinets with cable management.